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SMT GASKET適合SMD製程打件組裝 為了不需要的電磁波而產生的機能失常或降低EMI雜訊而研發的材料 SMT GASEKT適合高速組裝,具有優良的導電性,耐熱性及接地特性 此為專利產品,在歐,美,日本,中國大陸皆有專利權
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| ITEM |
Test Method |
Properties |
| Material Description |
Base Material |
- |
Silicone rubber/PI Film |
| Filler (Core)> |
- |
Carbon |
| Color |
Visual |
Silver |
| Heat Resistance (°C) |
Internal Test Method |
400℃ |
| Service Temp. (°C) |
Internal Test Method |
-40 ~ + 280℃ |
| Electric Resistance( Ω ) |
Origin |
HIOKI 3540 mΩ HITESTER |
Max. 0.1 Ω |
| Thermo-hygrostat |
Max. 0.1 Ω |
| Brine Atomizing |
Max. 0.1 Ω |
| Thermal Shock |
Max. 0.1 Ω |
| Adhesion Strength (gf)> |
UTM |
Min. 1500gf |
| Compression-Deflection Rate (%) |
20% Compression |
>Min. 95% |
| 85°C/85%RH, 200Hr |
| Hardness |
KS M 6519 (Shore A) |
65 ± 8 |
| Flammability |
UL 94 |
UL 94-V1 |
| RoHS & Halogen Free |
Pb, Cd, Hg, Cr+6, PBBs, PBDEs, Br, Cl |
N.D. |
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