IDT-EC(B20)-TC Type

Introduction IDT-EC(20) series has high thermal transfer performance in thin & flexible foam and designed for the latest thiner electronics and telecommunication devices. Ideal item for small elecric device such as mobile phone, navigation Effective thermal solution by horisontal thermal spread mechanism Higher thermal transfer performance by dielecrical thermal transfer adhesive No concern of elecrical short circuit by dielecrical thermal transfer adhesive Flexible in surface insulate sheet and safe in use Features

Superior flexibility, reworkability & processiability No particle dropping and no concern of electrical short circuit No split of layers causes lower thermal transfer performance Easy to apply uneven area Applicable to the thin electronics Own patent by unique technology and integrated knohow

Product Cross-Sectional View

Products Fundamental

Specifications

Item IDT-EC series Reference Content Type In-Plane 　 Standard Size Roll : 1,000mm Ⅹ 50m, Sheet : 210mm Ⅹ 300mm 　 Thickness (mm) 0.06, 0.08, 0.10, 0.11, 0.15 　 Color Black 　 Horizontal Therm. Cond. (W/m-K) 250 ASTM E 1461 Adhesive Strength (gf/25mm) Min. 1000 KS T 1028 Service Temp.(℃) -10 ~ 120 　 RoHS & Halogen N.D